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Title:	Success Story: Sigma-5 - Semiconductor Chip Die-Bonding (step/dir)
Number:	AS.MCD.08.068
Date:	01/23/2009
Description:	Application Success Story for Sigma-5 used in semiconductor chip die-bonding application. Short positioning time and settling time is critical in a quick point-to-point application like die-bonding. Accuracy and speed are often balanced, but with Sigma-5, improvements in both areas are achieved - surpassing competition. Customer's upper controller was used with step/direction interface to the Sigma-5 amplifiers.
Rev Number:	1
Language:	English
Doc Type:	Application Documents
Doc SubType:	Application Success

Product Information

Product Group:	Servo Products
Product Line:	SGDV Analog